| PART |
Description |
Maker |
| LBH1035 |
Soldering methods
|
LUXPIA
|
| AN10365 |
Surface mount reflow soldering
|
NXP Semiconductors
|
| GP1S33 |
Subminiature, Reflow Soldering Type Photointerrupter
|
SHARP[Sharp Electrionic Components]
|
| NFSW757DT |
Pb-free Reflow Soldering Application, Built-in ESD Protection Device
|
NICHIA CORPORATION
|
| SMX-3F |
Ultra low profile SMD Crystal Reflow soldering @ 260 °C
|
QUARTZCOM the communications company
|
| 50TZV100M8X10.5 10TZV680M8X10.5 35TZV47M6.3X6.1 35 |
105 Low Impedance, Lead Free Reflow Soldering.
CHIP ALUMINUM ELECTROLYTIC CAPACITORS
|
RUBYCON CORPORATION
|
| STW7T16A |
White colored SMT package Pb-free Reflow Soldering Application
White colored SMT package Pb-free Reflow Soldering Application
|
Seoul Semiconductor
|
| OSM5XZEHE1E |
Xeon H Power Warm White LED Avoid Reflow Soldering Process Long Lifetime Operation
|
OptoSupply International
|
| TEMT6000X01 |
Ambient Light Sensor, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
|
Vishay Siliconix
|
| TEMT6200FX0108 TEMT6200FX01 |
Ambient Light Sensor in 0805 Package, RoHS Compliant, Released for Lead (Pb)-free Reflow Soldering, AEC-Q101 Released
|
Vishay Siliconix
|
